Selamlar, Asus X550VX-147DX modelinde bilgisayarım dahili olarak 4 GB 2133 RAM'e sahip, bilgisayarı aldığımda Kingston'un 9905624-008.A00G modelindeki 8GB RAM'inden ekletmiştim. Şuan bu ram'i iptal edip yerine 16GB bir ram takmak istiyorum,
Bu da ram soketi, tek yuva; https://laptopmedia.com/wp-content/uploads/2016/08/DSC09929-680x383.jpg General Module Information Module Number: 2 Module Size: 8 GBytes Memory Type: DDR4 SDRAM Module Type: SO-DIMM Memory Speed: 1066.7 MHz (DDR4-2133 / PC4-17000) Module Manufacturer: Kingston Module Part Number: 9905624-008.A00G Module Revision: 0.0 Module Serial Number: 571742212 (04181422) Module Manufacturing Date: Year: 2016, Week: 28 Module Manufacturing Location: 5 SDRAM Manufacturer: Micron DRAM Steppping: 4.1 Error Check/Correction: None Module Characteristics Row Address Bits: 16 Column Address Bits: 10 Module Density: 8192 Mb Number Of Ranks: 1 Number Of Bank Groups: 4 Device Width: 8 bits Bus Width: 64 bits Die Count: 1 Module Nominal Voltage (VDD): 1.2 V Minimum SDRAM Cycle Time (tCKAVGmin): 0.93800 ns (1066 MHz) Maximum SDRAM Cycle Time (tCKAVGmax): 1.50000 ns CAS# Latencies Supported: 9, 11, 12, 13, 14, 15, 16 Minimum CAS# Latency Time (tAAmin): 13.500 ns Minimum RAS# to CAS# Delay (tRCDmin): 13.500 ns Minimum Row Precharge Time (tRPmin): 13.500 ns Minimum Active to Precharge Time (tRASmin): 33.000 ns Supported Module Timing at 1066.7 MHz: 15-15-15-36 Supported Module Timing at 933.3 MHz: 13-13-13-31 Supported Module Timing at 800.0 MHz: 11-11-11-27 Supported Module Timing at 666.7 MHz: 9-9-9-22 Minimum Active to Active/Refresh Time (tRCmin): 46.500 ns Minimum Refresh Recovery Time Delay (tRFC1min): 350.000 ns Minimum Refresh Recovery Time Delay (tRFC2min): 260.000 ns Minimum Refresh Recovery Time Delay (tRFC4min): 160.000 ns Minimum Four Activate Window Delay Time (tFAWmin): 21.000 ns Minimum Active to Active Delay Time - Different Bank Group (tRRD_Smin): 3.700 ns Minimum Active to Active Delay Time - Same Bank Group (tRRD_Lmin): 5.300 ns Minimum CAS to CAS Delay Time - Same Bank Group (tCCD_Lmin): 5.355 ns Features Module Temperature Sensor (TSOD): Not Supported Module Nominal Height: 29 - 30 mm Module Maximum Thickness (Front): 1 - 2 mm Module Maximum Thickness (Back): 1 - 2 mm Address Mapping from Edge Connector to DRAM: Standard |
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